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Lecturer(s)
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Bakalova Totka, Ing. Ph.D.
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Daďourek Karel, doc. Ing. CSc.
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Svobodová Lucie, Ing. Ph.D.
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Krafka Michal, Ing.
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Course content
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Lectures 1. Kinetic gas theory Atom mass, Avogadrovo number, thermal mobility, collision frequency, mean free path, energy trancfer during collisions, Boltzmannovo equation, mean energy and velocity. The correlation between the microscopic values and the gas temperature and pressure. Vacuum, pumping methods and pumping speed. Residence time of a particle in the reactor 2. Plazma Basic plasma parameters. Thermal and isothermal plasmas, electron and ion temperature. Plasma quasineutrality. Plasma and floating potential. Debye length, plasma sheath. Plasma frequency. Basic principles of plasma diagnostics. 3. Principles of plasma processing Production of active species in plasma. Collisions in plasma - type of collisions, collision cross section. Plasma-surface interaction. Volume and surface reactions. Type of plasma processes 4. DC-Electrical discharges Types of electrical discharges. DC electrical glow discharge. Current-voltage characteristic, phenomenological description of the dc discharge. Low pressure and high pressure discharges Towsend theory, Child-Langmuir equation. of the discharge, 5. AC- discharges type of ac dischargec - ac, rf and microwave discharges. Inductive and capacitive RF discharges. Formation of the self-bias. Microwave discharges, ECR. Downstream microwave discharge. Surface wave. 6. Plasma reactors Planar reactor, cylindrical reactor. Reactors with internal and external electrodes. AC and microwave reactors. Dual systems. Gaseous Conference Reference Cell. Nízkotlaký plasma-jet. 7. Principle of Plasma sputtering, magnetrons, Principles of PVD technique. Plasma confinement with magnetic field. Principle of planar magnetron. Unbalanced magnetron. Target utilization. 8. Principle of Plasma Enhanced CVD Principle of PE CVD technique. Characteristic processes parameters. Deposition of hard coatings. Differences between PVD and CVD 10. Plasma etching Principle. Application in the semiconductor industry. Plasma etching of polymers. Plasma cleaning. 11. Plasma surface modification Hardness enhancement of metal surfacese - plasma nitridation and oxidation. Polymer surface modification - enhancement of wetability, plasma grafting 12. Atmospheric pressure processes High temperature and low temperature processes. Plasma arc deposition and plasma spraying. Corona discharge, filamentary and atmospheric pressure glow discharges. Workshop 1. Vacuum technology 2. Plasma modification of plastics 3. Plasma enhanced thin film deposition 4. Investigation of high pressure filamentary discharge
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Learning activities and teaching methods
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Monological explanation (lecture, presentation,briefing)
- Class attendance
- 56 hours per semester
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Learning outcomes
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Fundamentals, methods and applications of plasma surface technology.
Qualification in plasma technology.
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Prerequisites
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Teoreticals study courses (Physics, Materials).
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Assessment methods and criteria
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Combined examination
1. Passing out of practical exercises 2. Useful passing of examination
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Recommended literature
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.A.LIEBERMAN, A.J.LICHTENBERG. Principles of Plasma Discharges and Materials Processing. John Wiley & Sons 1994.
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A.SHERMAN. Chemical Vapor Deposition for Microelectronics. Noyes Publications 1987.
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B.N. CHAPMAN. Glow Discharge Processes. Johl Wiley & Sons 1980.
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F.F.CHEN. Úvod do fyziky plazmatu. Academia Praha.
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J. REECE ROTH. Industrial Plasma Engineering: Applications. Institute of Physics Pub 2001, 2001.
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J.L.VOSSEN, W.Kern:. Thin Film Processes. Academic Press 1978. Academic Press, 1978.
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R. D'AGOSTINO. Plasma Deposition,Treatment and Etchin of Polymers. Academic Press 1990.
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VLČEK:. Úvod do fyziky plazmatu. Skripta. Plzeň, ZČU - FAV.
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